项       目 SUBJECT	内       容 CONTENTS
层   数 Layer	单、双面/多层（2-12层） Single-double-sided/multi-laye(2-12 layers)
基   材 Base Material	高TG板、铝基板、ROGERS板、聚四氧乙烯板（TEFLON）、陶瓷基板、厚铜板 High-TG board、aluminum-based board，ROGERS board，PTFE TEFLON board，thick-copper board
表 面 工 艺 Surface Technology	有铅工艺：喷锡板、喷锡金手指 Lead technique: hot air leveling board, hot air leveling golden finger
	无铅工艺：无铅喷锡板、镀金版、沉镍金板、沉锡板、有机保焊膜板（OSP)\沉银板 Lead-free technique: lead-free hot air leveling board, gold plating board, ENIG board, EN board, OSP board, ES board
特 殊 工 艺 Special Technology	阻抗板（阻抗要求在±5-10%） Impedance board (impedance is required to ±5-10%)
	高频板（无线通讯） High-frequency board (wireless telecommunication)
	高TG板/无卤板/无卤高TG板（适合无铅开发工艺） High-TG board/halogen-free board/halogen-free high-TG board (suitable for lead-free development technique)

项       目 SUBJECT	内       容 CONTENTS
加  工  板  厚  度 Width of Processing Board	成品厚度：0.4mm以上 Finished product width: 0.4mm 以上
	①、内层芯板：0.17mm（含铜）     core material: 0.17mm (bearing copper)
	②、双层板：0.2mm（含基板铜、镀层和阻焊）     Double-layer board: 0.4mm (bearing substrate copper, plating and solder resist)
	③、四层板：0.40mm（含基板铜、镀层和阻焊）     Four-layer board: 0.40mm(bearing substrate copper, plating and solder resist)
	④、六层板：0.60mm（含基板铜、镀层和阻焊）     Six-layer board: 0.60mm (bearing substrate copper, plating and solder resist)
	⑤、八层板：按层数增加     Eight-layer board: increase by layer
加工尺寸 Processing Size	最大加工尺寸：1200MM X 450MM The maximal processing size: 1200MM X 450MM
	最小加工尺寸：5MM X 5MM The minimal processing size: 5MM X 5MM
最小孔径 Minimal hole diameter	成品孔径：0.2mm Finished hole diameter: 0.2mm

项       目 SUBJECT	内       容 CONTENTS
外  层  铜  厚 External copper width	当线宽/线距为:0.1mm/0.1mm或0.1mm/0.127mm时，外层铜厚:18μm When line width/interval:0.1mm/0.1mm, or 0.1mm/0.127mm，external copper width:18μm
	当线宽/线距为:0.1mm/0.15mm、0.13mm/0.13mm或0.15mm/0.13mm时，外层铜厚:35μm When line width/interval:0.1mm/0.15mm, 0.13mm/0.13mm, or 0.15mm/0.13mm，external copper width:35μm
	当线宽/线距为:0.13mm/0.16mm或0.15mm/0.15mm时，外层铜厚:70μm When line width/interval:0.13mm/0.16mm, or 0.15mm/0.15mm，external copper width:70μm
	当线宽/线距为:0.15mm/0.2mm、0.18mm/0.2mm或0.2mm/0.2mm时，外层铜厚:105μm When line width/interval:0.15mm/0.2mm, 0.18mm/0.2mm, or 0.2mm/0.2mm，external copper width:105μm
	当线宽/线距为:0.2mm/0.25mm、0.23mm/0.25mm或0.25mm/0.25mm时，外层铜厚:140μm When line width/interval:0.2mm/0.25mm, 0.23mm/0.25mm, or 0.25mm/0.25mm，external copper width:140μm
	当线宽/线距为:0.25mm/0.3mm、0.28mm/0.3mm或0.3mm/0.3mm时，外层铜厚:175μm When line width/interval:0.25mm/0.3mm, 0.28mm/0.3mm, or 0.3mm/0.3mm，external copper width:175μm

项       目 SUBJECT	内       容 CONTENTS
最小孔环 Minimal Annular Ring	单边最小孔环：0.1mm Single-in-line minimal annular ring: 0.1mm
最小线宽线距 Minimal line width and line interval	最小线宽：0.1mm 最小线距：0.1mm（成品要求） Minimal line width: 0.1mm   Minimal line interval: 0.1mm (comply with finished products’ requirement)
板厚纵横比 Board width aspect ratio	8:1
阻焊油墨类型 Solder mask printing ink	感光系列：绿色、黑色、红色、黄色、白色、咖啡色、紫色、蓝色、棕色等 Photo-imageable series: green, black, red, yellow, white, coffee, purple, blue, brown, etc.
	哑光系列：绿色、黑色 Matt series: green, black
外形加工方式 Processing method  to appearance	模冲、电铣（CNC）、手锣、V-CUT（自动及手动）、斜边、倒角 Stamping, electric milling (CNC), hand rout, V-Cut (automatic and manual), beveling, Chamfer
公    差 allowable error	线宽±20%、孔径±3Mil、外形±0.13mm(特殊工艺另定) Line width ±20%, hole diameter ±3Mil, appearance ±0.13mm (special technique can be custom-made)

项       目 SUBJECT	内       容 CONTENTS
镀 层 厚 度 Plated coating width	喷锡板：铜厚20-35μm、锡厚50-150μm Hot air leveling board: copper width 20-35μm, tin width 50-150μm
	沉金板：镍厚2.5-5μm、金厚0.05-0.1μm EN board: nickel width 2.5-5μm, gold width 0.05-0.1μm
	电金板：镍厚2.5-5μm、金厚0.02-0.1μm Electric gold board: nickel width 2.5-5μm, gold width 0.02-0.1μm
	金手指板：镍厚2.5-5μm、金厚0.075-1.27μm Golden finger board: nickel 2.5-5μm, gold width 0.075-1.27μm
翘 曲 度 Angularity	SMT≤0.75%
	非SMT≤1.5% None-SMT≤1.5%
验 收 标 准 Acceptance standard	IPC-600H||级或客户指定 IPC-600H|| level or custom-made level